Job DescriptionSince introducing the world's first product based on hybrid silicon lasers nearly a decade ago, Intel Silicon Photonics team continues to lead the industry with cutting-edge technology and unmatched hybrid laser reliability. Our dedication to advanced development ensures that Intel Silicon Photonics continues to drive future data center bandwidth growth with smaller form factors, co-packaging and higher speeds from 800Gb today to 1.6Tb+ and beyond tomorrow. We are looking for great talent to accelerate this journey so if you are interested in joining our leading organization then we want to hear from you.As a Silicon Photonics (SiPh) Technology Development Quality and Reliability Engineer (QRE), you will be at the forefront of silicon photonics technology development and work closely with the SiPh fab process integration, Silicon Photonics Product Division (SPPD) R&D design team, and others to assess reliability for our new SiPh device technologies, process certification, and product qualifications.Our fab site is located at Rio Rancho, on the outskirts of Albuquerque, New Mexico. Intel is located at the heart of a growing and vibrant community, but still a short driving distance from beautiful parks with endless year-round outdoor activities.Responsibilities may include but not be limited to:
Develop, apply, and maintain quality and reliability standards for Silicon Photonics (SiPh) processing materials into partially finished or finished product to meet Intel’s stringent quality and reliability requirements.
Deliver standardization in technology/process certification, product qualification, manufacturing quality systems, methods, and documentation.
Work closely with the Technology Development Teams to proactively drive reliability improvements and address reliability concerns throughout the process development and certification process, including tracking to committed milestones and collateral, working through program managers, integration, and fellow SiPh TD Q&R engineers.
Determine reliability requirements and automated screening methodologies of components and systems to achieve company, customer, and any governmental agency reliability objectives.
Risk assessment, containment, communication, and investigation of questionable/discrepant material.
Evaluate the materials, process, and techniques used in fabrication to meet the requirement of products and production equipment.
Risk assessment, containment, communication, and investigation of questionable/discrepant material
Determine reliability requirements and automated screening methodologies of components and systems to achieve company, customer, and any governmental agency reliability objectives.
Self-driven to improve knowledge and expertise in SiPh fabrication process, device, and product quality/reliability to act as first point-of-contact for all new process-related issues, owning strategic direction and providing technical inputs in all task forces, focus teams, and working groups.
Collaborate with the extended SiPh TD Q&R team (product, assembly integration, transceiver module, FA, etc) to develop new reliability characterization and acceleration techniques, analytical tools, and quality screens to assure the early identification of potential problems with new processes, process changes, products, and product quality/reliability.
Specifies inspection and testing mechanism, conduct quality assessment (up to and including audits) and perform statistical analysis to determine the disposition of products and systems that do not meet required specifications.
Provide feedback to the Business Unit, Technology Development and/or partner engineering group on design or method and statistical process control procedures including manufacturing systems in High Volume Manufacturing (HVM), respond to customer requests or events as they occur.
Work with business unit partners to identify, prioritize and track requests to SiPh TD Q&R; these requests may include changes to the technical scope of support for the business.
The ideal candidate should exhibit the following behavioral traits:
Excellent communication skills (both verbal and written).
Strong networking, teamwork, and social skills.
Emotional intelligence, and the ability to work in a diverse and multi-cultural team environment.
Work under pressure, and in an ever-changing and dynamic environment
Push forward multiple parallel efforts (multi-tasking) in a constrained environment.
Strong problem-solving skills.
Curious, eager, proactive, and quick to learn.
Independent thinker who can drive and develop solutions and implement them.
In addition to the qualifications a successful candidate will demonstrate:
Usage of failure mode effects analyses and model-based problem-solving approaches.
Knowledge of statistics and data analysis, including the use of tools such as Excel and JMP.
Skills to deliver concise key messages for senior management review
Influencing cross-functional teams to achieve extraordinary results.
Strong execution experience
Passionate about quality and reliability as it relates to developing new technologies.
This position will not be eligible for Intel immigration sponsorship.QualificationsMinimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Minimum Qualifications:
MSc in Materials Science, Chemistry, Chemical Engineering, Physics, photonic devices, or related fields
2+ years of relevant engineering experience in semiconductor fab process or device characterization or yield, or reliability, or test/validation.
Preferred Qualifications:
PhD in Materials Science, Chemistry, Chemical Engineering, Physics, photonic devices, or related fields
2+ years’ experience in process certification/product qualification and reliability risk assessment, quality systems, and quality culture knowledge.
Knowledge of Intel’s manufacturing process, manufacturing process development, material characterization and development, design validation.
Experienced in model-based problem solving and familiar with other industry standard problem-solving techniques (5 why's, 8D).
Hands-on semiconductor wafer fabrication process and process integration challenges.
Semiconductor device physics and defect mechanism knowledge.
Photonic device physics knowledge and hands-on compound semiconductor processing experience.
Reliability failure statistics, physics, failure mechanisms, and failure analysis methodologies.
Experience in experimental design execution and statistical analysis
Knowledge and use of SPC/DOE principles
Data extraction and analysis skills (JMP/Crystal Ball/ILM/REL/PCS/SQL Scripting).
Inside this Business GroupAs the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.Posting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)Working ModelThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.