Vacancy caducado!
- Strong Compensation & Benefits Package
- Extensive PTO
- Huge Room for Growth
- Weekly Lunches & Fun Company Culture!
- Great 401k Match
- Health, Vision, Dental Benefits
- Develop new packaging technology for our MEMS-based timing solutions
- Spearhead development of new packaging structures and technologies
- Identify new materials, develop material models and characterization methodologies
- Optimize recipes and processes to improve long-term device performance
- Perform thermal/electrical/electromagnetic/mechanical/stress simulation and design
- Lead troubleshooting activities related to package design or performance
- MS or PhD in Mechanical Engineering, Material Science, or equivalent science field
- Working knowledge of semiconductor IC packaging technology and methodology
- Understanding of semiconductor packaging materials, such as epoxies, polymers, and solders
- Hands-on experience with mechanical and thermal simulation and design
- Hands-on experience with CAD software (AutoCAD preferred but not required)
- Hands-on experience with finite element analysis (COMSOL preferred but not required)
- Hands-on experience with IC package modelling software and techniques
- MATLAB scripting ability
- Hands-on familiarity with lab instruments such as oscilloscopes, frequency counters, etc.
- Experience with material characterization techniques (DMA, TMA, TGA, etc.)
Vacancy caducado!