Company:Qualcomm Technologies, Inc.Job Area:Engineering Group, Engineering Group > Software EngineeringGeneral Summary: The Snapdragon chipsets have pushed the power envelope of Mobile products with more and more complex use cases and workloads. This has introduced significant challenges in extending the battery life of the product on one spectrum and achieving superior performance within the device thermal and power envelope on the other spectrum. Coming up with diverse and innovative approaches in software is very critical in solving these broad and deep cutting-edge technical problems. Interested in playing a key role in optimizing thermal performance of next generation Mobile products on Snapdragon? Join Qualcomm's Thermal/Limits Software team to work on bleeding edge Snapdragon products. Join QUALCOMM's team in San Diego, CA, and work closely with System engineers, Software and Hardware developers in a world-class team. Enjoy life in sunny San Diego on the Pacific coast of California. In this role, the candidate is expected to own and drive the analysis of complex system level use cases spanning across various Application processor and Modem technologies and coming up with solutions to improve performance of the Mobile products under the power and thermal constraints. The scope of work spans across a variety of workloads touching every aspect of the silicon including CPU/GPU/AI benchmarks, Productivity use cases, Streaming scenarios, Gaming use cases, Media streaming and High-throughput Modem use cases. An ideal candidate would have a few years of experience with system level power/thermal/performance analysis. In addition, the candidate is also expected to contribute to: development of algorithms and techniques to optimize power consumption and thermal performance of various compute use cases, perform system level software optimizations using hardware and software power/thermal management techniques and use advanced machine learning techniques in solving system level power and thermal problems. Minimum Qualifications: Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.Preferred Qualifications:
Experience in ARM assembly language, C, C, Python
Strong familiarity with ARM architecture
Good understanding of System On Chip architectural concepts.
Experience in Power/Thermal/Performance optimizations to improve product level KPIs.
Real-time operating systems, multi-threaded processor architectures
Communication skills, effective team player, able to work independently.
Strong analytical and problem-solving skills.
Master's degree in Computer Engineering, Electrical Engineering, Computer Science, or related field.
Experience with programming (e.g., C, C, Python), computer architecture, or embedded systems.
Applicable wireless, semiconductor and/or embedded software industry experience.
Principal Duties and Responsibilities:
Applies Software knowledge to assist and support the design, development, creation, modification, and validation of embedded and cloud edge software, applications, and/or specialized utility programs.
Analyzes user needs and software requirements.
Designs and implements small software features for products and systems.
Participates in the design, coding for small features, unit testing, minor debugging fixes, and integration efforts to ensure projects are completed on schedule.
Assists in performing code reviews and regression tests as well as the triaging of issues to ensure the quality of code.
Collaborates with others inside project team to accomplish project objectives.
Writes technical documentation for Software projects.
Level of Responsibility:
Works under supervision.
Decision-making affects direct area of work and/or work group.
Requires verbal and written communication skills to convey basic, routine factual information.
Tasks require multiple steps which can be performed in various orders; some planning, problem-solving, and prioritization must occur to complete the tasks effectively.
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