Lightmatter is redefining what computers and human beings are capable of by delivering a fundamentally new kind of computer that calculates using light. Transistors, the workhorse of modern computers, aren't improving at the rate they once were. To scale AI, companies are building increasingly large and energy-expensive data centers—a path that is neither financially nor environmentally sustainable. By delivering ultra-high performance and energy efficiency, Lightmatter’s compute engine will power rapid advancements in AI while lowering its environmental footprint. We are inviting a Mechanical Engineer with structural analysis expertise and deep knowledge of semiconductor packaging technologies to our team.In this role, you will be working on leading-edge packaging technologies to enable AI architectures that will set new industry standards concerning compute power, performance, and efficiency. You will be part of the Packaging Technology team as lead assembly process integrator. In this role, you will be responsible for working across design, FAB, and OSAT partners to develop assembly process technology for the wafer-to-wafer bonding and generate design, assembly, and test rules that meet product performance requirements. You will be responsible for developing test chip strategies, managing test chip design, and appropriately planning and managing the design of experiments with partners. In addition, you will be working closely with package and system architects to bring manufacturability views to product definitions. The results of your work will lead to advanced package designs that meet assembly and reliability requirements while delivering leading-edge products in the data centers and high-end computing segment. Responsibilities:
Develop assembly process flows required for wafer-to-wafer hybrid bonding, working closely with OSAT partners
Define test chip requirements manage test chip design required for wafer-to-wafer hybrid bonding process development
Develop and validate design, assembly and test, including all the backend/RDL rules to deliver high yielding assembly process for wafer-to-wafer hybrid bonding
Develop strategies to manage silicon packaging interaction
Plan and execute the design of experiments, data management, and performing appropriate analysis to provide insight into the assembly process and design interactions.
Perform analysis to identify key reliability risks under product use conditions; drive appropriate design and materials solutions to improve product mechanical integrity.
Summarize and communicate to key stakeholders across Lightmatter, suppliers and customers as required.
Write reports and document methodologie
Requirements
MS or PhD in Mechanical Engineering, Material Science, or related Engineering field
5-8 years of experience in wafer-scale packaging assembly process development.
Experience in hybrid bonding process, wafer-to-wafer bonding process development
Experience in test chip design
Knowledge of wafer-to-wafer process flow, materials, and tooling requirement
Knowledge of 2D/3D packaging technologies and exposure to thermo-mechanical challenges associated with these technologies.
Preferred Qualifications
Excellent communication skills and ability to work well in cross-functional teams
Ability to work independently and tackle projects with minimal supervision
Ability to think creatively and solve problems quickly
Benefits
Comprehensive Health Care Plan (Medical, Dental & Vision)
401k matching
Life Insurance (Basic, Voluntary & AD&D)
Generous Time Off (Vacation, Sick & Public Holidays)
Paid Family Leave
Short Term & Long Term Disability
Training & Development
Flexible, hybrid workplace model
Stock Option Plan
We offer competitive compensation. The base salary range for this role is $160,000 to $240,000 inclusive of all US locations. Your base salary will be determined based on location, experience, educational background, and market data.Lightmatter recruits, employs, trains, compensates, and promotes regardless of race, religion, color, national origin, sex, disability, age, veteran status, and other protected status as required by applicable law.