Wet Etch & Electroplating Wafer Engineering Technician (Night Shift)

ESSENTIAL DUTIES AND RESPONSIBILITIES:Perform daily job duties to provide engineering support in Wet Etch and Electroplating area.Basic understanding of different electroplating bath chemistry in order to request necessary bath adjustment if needed.Perform basic operation of different wet etch, electroplating, metrology and inspection tools in both manual and automatic mode.Perform non-standard process and can create or edit process recipe as well as create or edit wafer level CRMS.Good understanding of SPC chart and how to react to different violations according to SPEC/OCAP as well as analyzing the Electroplating process/tool performance using basic knowledge in statistics and data analysis.Disposition hold wafer according to SPEC or disposition criteria provided by Process Engineer.  Also capable of dispositioning hold wafer with own judgement based on risk assessment, process expertise or related previous experience.Basic knowledge of IT-related application and software such as CRMS, APC, MITECS, GS3, TSD report, EDCSPC, SPC chart, Fabtime, etc.Notify Process Engineer and Manufacturing team if there's any suspected excursion.  Do preliminary investigation, identify and hold all potentially affected wafers to contain the problem and minimize the impact.Train wafer fab operators with new process or tool.Lead and support team project.