Job Details

ID #51368649
Estado New York
Ciudad Newyorkstate
Fuente FuzeHub
Showed 2024-03-31
Fecha 2024-03-27
Fecha tope 2024-05-26
Categoría Arquitecto/ingeniero/CAD
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Semiconductor Packaging Engineer

New York, Newyorkstate
Aplica ya

diverse team supporting photonics and electronic integrated circuit technologies.

The position is for a back-end process / packaging engineer to join our packaging process engineering team to support manufacturing and development of semiconductor-based optics/

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